The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Dec. 05, 2013
Applicant:
Tesa SE, Hamburg, DE;
Inventors:
Klaus Keite-Telgenbüscher, Hamburg, DE;
Jan Ellinger, Hamburg, DE;
Judith Grünauer, Hamburg, DE;
Anika Petersen, Bimöhlen, DE;
Assignee:
TESA SE, Norderstedt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/26 (2006.01); C09J 7/22 (2018.01); C09J 7/29 (2018.01); C09J 153/02 (2006.01); C09J 171/00 (2006.01); C09J 177/02 (2006.01); C09J 177/06 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); B32B 27/14 (2006.01); B32B 27/32 (2006.01); C09J 153/00 (2006.01); H01L 51/52 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C09J 7/22 (2018.01); B32B 27/14 (2013.01); B32B 27/32 (2013.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); H01L 23/26 (2013.01); B32B 2264/10 (2013.01); B32B 2405/00 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C09J 153/005 (2013.01); C09J 153/025 (2013.01); C09J 171/00 (2013.01); C09J 177/02 (2013.01); C09J 177/06 (2013.01); C09J 2201/128 (2013.01); C09J 2201/20 (2013.01); C09J 2201/606 (2013.01); C09J 2201/61 (2013.01); C09J 2203/326 (2013.01); C09J 2205/106 (2013.01); C09J 2400/123 (2013.01); C09J 2400/243 (2013.01); C09J 2400/263 (2013.01); C09J 2423/006 (2013.01); C09J 2423/046 (2013.01); C09J 2433/00 (2013.01); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01); C09J 2471/00 (2013.01); H01L 23/3164 (2013.01); H01L 51/524 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24331 (2015.01); Y10T 428/249983 (2015.04); Y10T 428/2848 (2015.01);
Abstract
The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.