The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Jan. 20, 2017
Applicant:

Mitsui Minig & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Mikimasa Horiuchi, Tokyo, JP;

Ryutaro Kuroda, Tokyo, JP;

Yasuhide Yamaguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/00 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01); B24B 7/10 (2006.01); B24D 3/02 (2006.01); B24D 11/00 (2006.01); B24D 18/00 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 7/10 (2013.01); C09K 3/1409 (2013.01); C08K 2003/2262 (2013.01);
Abstract

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size Dof the longitudinal axis of the observed particles is 1.0 μm or less, and if the particle size Dof the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 μm or less.


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