The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Mar. 22, 2016
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Minsoo Kim, Suwon-si, KR;

Younhee Nam, Suwon-si, KR;

Jaeyeol Baek, Suwon-si, KR;

Hyunji Song, Suwon-si, KR;

Byeri Yoon, Suwon-si, KR;

Seulgi Jeong, Suwon-si, KR;

Seunghee Hong, Suwon-si, KR;

Sunmin Hwang, Suwon-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 8/10 (2006.01); C09D 161/06 (2006.01); H01L 21/033 (2006.01); C08G 8/20 (2006.01); C08G 8/24 (2006.01); G03F 7/075 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
C09D 161/06 (2013.01); C08G 8/10 (2013.01); C08G 8/20 (2013.01); C08G 8/24 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); H01L 21/0332 (2013.01);
Abstract

An organic layer composition includes a first compound having a thermal shrinkage ratio of about 10% to about 70%, a second compound having a smaller thermal shrinkage ratio than the first compound, and a solvent, and an organic layer obtained by curing the organic layer composition and a method of forming patterns using the organic layer composition are disclosed. A method of measuring the thermal shrinkage ratio is described in the detailed description.


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