The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Sep. 08, 2015
Applicant:
Mitsubishi Rayon Co., Ltd., Chiyoda-ku, JP;
Inventors:
Koichi Akiyama, Tokyo, JP;
Yuji Kazehaya, Tokyo, JP;
Mitsushi Nishimura, Tokyo, JP;
Shinichiro Furuya, Tokyo, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08J 5/04 (2006.01); B29C 70/50 (2006.01); B29C 70/46 (2006.01); B29K 33/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B29C 70/504 (2013.01); C08J 5/042 (2013.01); B29C 70/465 (2013.01); B29K 2033/08 (2013.01); B29K 2105/0872 (2013.01); B29K 2307/04 (2013.01); C08J 2363/10 (2013.01); C08J 2367/06 (2013.01); C08J 2375/14 (2013.01);
Abstract
The present invention relates to a molding material, having: (A): a fiber substrate made of carbon fibers 5 mm or longer; (B): at least either an epoxy (meth)acrylate resin or an unsaturated polyester resin; (C): (C-1) inorganic fibrous filler with a cross-sectional area of at least 0.8 μm, or (C-2) inorganic flaky filler with a cross-sectional area of at least 0.05 μm, both of which have an aspect ratio of 2.0 or higher and a length of less than 3 mm; and (D): a polyisocyanate compound.