The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Oct. 05, 2015
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Kazuhiro Tsuchida, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 7/18 (2006.01); C09D 183/06 (2006.01); C09J 11/06 (2006.01); C09J 133/04 (2006.01); G02F 1/1335 (2006.01); G02B 5/30 (2006.01);
U.S. Cl.
CPC ...
C07F 7/1892 (2013.01); C07F 7/1804 (2013.01); C09D 183/06 (2013.01); C09J 11/06 (2013.01); C09J 133/04 (2013.01); G02B 5/30 (2013.01); G02F 1/1335 (2013.01);
Abstract

The purpose of the present invention is to obtain an organosilicon compound containing an isocyanate group by thiol-ene addition reaction from a corresponding organosilicon compound having a mercapto group and an isocyanate compound having a polymerizable group. Provided is a silane coupling agent which includes a specific linking structure in which a sulfur atom is indispensably contained in a linking chain which connects an isocyanate group to a hydrolyzable silyl group. Compared to silane coupling agents for use in existing technologies, this silane coupling agent has enhanced hydrophobicity and an increased organic-moiety proportion due to the sulfur-containing linking structure. Use of this silane coupling agent as an adhesive modifier hence makes it possible to obtain a pressure-sensitive adhesive in which the silane coupling agent has improved compatibility with the resin and is excellent in terms of strength of bonding to and interaction with the matrix resin having hydroxy groups and which is able to have initial reworkability and further have high adhesive force at high temperatures or under high-temperature high-humidity conditions.


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