The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Mar. 20, 2014
Applicants:

Daicel Polymer Ltd., Minato-ku, Tokyo, JP;

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventors:

Daiji Ikeda, Himeji, JP;

Yoshihiro Asami, Himeji, JP;

Assignees:

DAICEL POLYMER LTD., Minato-Ku, Tokyo, JP;

DAICEL CORPORATION, Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B23K 26/352 (2014.01); B23K 26/00 (2014.01); B23K 26/354 (2014.01); B32B 27/08 (2006.01); B32B 15/08 (2006.01); B23K 103/10 (2006.01); B23K 103/18 (2006.01); B29K 705/00 (2006.01); B29K 77/00 (2006.01); B29K 705/02 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 1/08 (2006.01); B23K 103/02 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01); B23K 103/08 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B23K 26/0006 (2013.01); B23K 26/0093 (2013.01); B23K 26/354 (2015.10); B23K 26/3584 (2018.08); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B23K 2103/02 (2018.08); B23K 2103/05 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/15 (2018.08); B23K 2103/16 (2018.08); B23K 2103/172 (2018.08); B23K 2103/18 (2018.08); B23K 2103/42 (2018.08); B29C 2045/14868 (2013.01); B29K 2077/00 (2013.01); B29K 2705/00 (2013.01); B29K 2705/02 (2013.01); B32B 1/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 2262/02 (2013.01); B32B 2262/0238 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/04 (2013.01); B32B 2262/062 (2013.01); B32B 2262/065 (2013.01); B32B 2262/10 (2013.01); B32B 2262/103 (2013.01); B32B 2262/106 (2013.01); B32B 2274/00 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2307/542 (2013.01);
Abstract

There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.


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