The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Oct. 16, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mahendra Christopher Orilall, Santa Clara, CA (US);

Timothy Michaelson, Santa Clara, CA (US);

Kasiraman Krishnan, Milpitas, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Fred C. Redeker, Fremont, CA (US);

Gregory E. Menk, Pleasanton, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24B 37/26 (2012.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/22 (2013.01); B24B 37/245 (2013.01); B24B 37/26 (2013.01); B24D 18/0045 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.


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