The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jul. 29, 2016
International Business Machines Corporation, Armonk, NY (US);
Ralph Heller, Wilen b. Wollerau, CH;
Patricia Maria Sagmeister, Adliswil, CH;
Martin Leo Schmatz, Rueschlikon, CH;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Embodiments of the present invention are directed to an integrated circuit (IC) package assembly. The IC package assembly includes a base printed circuit board (PCB), and a set of IC packages. Each of the IC packages includes at least one IC chip, mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip. In addition, each of the IC packages is laterally soldered to the base PCB (e.g., a motherboard PCB) and arranged transversally to the base PCB and forms an angle α therewith. As a result, a slanted stack of IC packages is obtained, wherein the IC packages are essentially parallel to each other. Further embodiments are directed to related devices, including the above assembly, and to related fabrication methods.