The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Mar. 27, 2014
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Hiroshi Tamagawa, Kyoto, JP;
Koichi Niino, Kyoto, JP;
Eiji Nukaga, Kyoto, JP;
Keishi Watanabe, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01C 1/14 (2006.01); H01G 4/228 (2006.01); H05K 1/11 (2006.01); H05K 5/02 (2006.01); H01C 1/012 (2006.01); H01G 2/06 (2006.01); H01G 4/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01C 1/012 (2013.01); H01C 1/14 (2013.01); H01G 2/065 (2013.01); H01G 4/228 (2013.01); H05K 1/11 (2013.01); H05K 5/02 (2013.01); H01G 4/40 (2013.01); H05K 3/3442 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract
The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.