The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Aug. 22, 2017
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventor:

Yasuyuki Hitsuoka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 3/0032 (2013.01); H05K 3/423 (2013.01); H05K 3/425 (2013.01); H05K 3/426 (2013.01); H05K 1/09 (2013.01); H05K 3/0035 (2013.01); H05K 3/427 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1572 (2013.01);
Abstract

A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.


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