The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Aug. 28, 2015
Applicant:

Nokia Technologies Oy, Espoo, FI;

Inventors:

Adam Robinson, Cambridge, GB;

Darryl Cotton, Hemingford Grey, GB;

Piers Andrew, Cambridge, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H01L 23/4985 (2013.01); H05K 1/189 (2013.01); H05K 3/103 (2013.01); H05K 2201/0314 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/09263 (2013.01);
Abstract

An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.


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