The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jan. 13, 2016
Applicant:

Multek Technologies Limited, San Jose, CA (US);

Inventors:

Pui Yin Yu, Tsuen Wan, HK;

Mark Zhang, Guangdong, CN;

Jiawen Chen, Guangdong, CN;

Assignee:

Multek Technologies Limited, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/067 (2013.01); H05K 3/181 (2013.01); H05K 3/4611 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 2203/0574 (2013.01); H05K 2203/06 (2013.01);
Abstract

A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.


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