The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Apr. 09, 2015
Massachusetts Institute of Technology, Cambridge, MA (US);
Glenn A. Brigham, Chelmsford, MA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Abstract
An assembly that includes a printed circuit board having an air gap, and a method of fabricating the assembly is disclosed. The assembly includes at least one air gap. This air gap is created by using a soluble material during the PCB assembly process. The soluble material can preferably be processed in accordance with traditional PCB fabrication processes. For example, other materials can be bonded to the soluble material. Additionally, the soluble material is capable of withstanding a drilling process. After the PCB assembly is complete, the soluble material is then dissolved, leaving an air gap where the soluble material once existed. This assembly may be useful in configurations where an antenna, EBG material or other electronic structure is to be disposed above the top surface of the printed circuit board.