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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10321031 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Feb. 16, 2018

Device attachment with infrared imaging sensor

Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Jeffrey D. Frank, Santa Barbara, CA (US);

Nicholas Högasten, Santa Barbara, CA (US);

Theodore R. Hoelter, Santa Barbara, CA (US);

Katrin Strandemar, Rimbo, SE;

Pierre Boulanger, Goleta, CA (US);

Barbara Sharp, Santa Barbara, CA (US);

Andrew C. Teich, West Linn, OR (US);

Dwight Dumpert, Goleta, CA (US);

Mark Nussmeier, Goleta, CA (US);

Eric A. Kurth, Santa Barbara, CA (US);

Gerald W. Blakeley, III, Lincoln, MA (US);

Michael Fox, Stillwater, OK (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Mirellys Jagan

Int. Cl.
CPC ...
G01K 5/00 (2006.01); G01K 1/00 (2006.01); H04N 5/225 (2006.01); H04M 1/02 (2006.01); H04N 5/365 (2011.01); H04N 5/232 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2252 (2013.01); H04M 1/0254 (2013.01); H04M 1/0264 (2013.01); H04N 5/23254 (2013.01); H04N 5/33 (2013.01); H04N 5/365 (2013.01); H04N 5/3651 (2013.01);
Abstract

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

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