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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10320356 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Apr. 04, 2018

Lc composite electronic component, and mounting structure for lc composite electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Hirokazu Yazaki, Nagaokakyo, JP;

Toshiyuki Nakaiso, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Rakesh B Patel

Int. Cl.
CPC ...
H03H 7/01 (2006.01); H03H 1/00 (2006.01); H01G 4/40 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/228 (2006.01); H01G 4/33 (2006.01); H01L 49/02 (2006.01); H01F 17/00 (2006.01); H01L 23/498 (2006.01); H01L 27/01 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 27/40 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 23/49822 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03H 1/00 (2013.01); H01F 2017/0026 (2013.01); H01L 27/016 (2013.01); H03H 2001/0057 (2013.01); H03H 2001/0085 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.

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