The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Mar. 25, 2015
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Albert J. Golko, Cupertino, CA (US);

Eric S. Jol, Cupertino, CA (US);

Christopher S. Graham, Cupertino, CA (US);

Paul J. Thompson, Cupertino, CA (US);

Jeffrey M. Alves, Cupertino, CA (US);

Stephen E. Yao, Cupertino, CA (US);

Makiko K. Brzezinski, Cupertino, CA (US);

Todd K. Moyer, Cupertino, CA (US);

Daniel Wagman, Cupertino, CA (US);

Micah Lewis-Kraus, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 7/02 (2016.01); H02J 50/10 (2016.01); H02J 7/00 (2006.01); H02J 50/90 (2016.01); H02J 50/70 (2016.01); H01F 27/02 (2006.01); H01F 38/14 (2006.01); H02J 50/12 (2016.01); H01F 27/22 (2006.01);
U.S. Cl.
CPC ...
H02J 50/10 (2016.02); H01F 27/025 (2013.01); H01F 38/14 (2013.01); H02J 7/0042 (2013.01); H02J 50/70 (2016.02); H02J 50/90 (2016.02); H01F 27/22 (2013.01); H02J 50/12 (2016.02);
Abstract

A thermal management system for an electromagnetic induction-power transfer system. The system may include a charging apparatus including a housing that defines an interface surface. An accessory or induction-power consuming apparatus may be positioned proximate to the interface surface. The housing of the charging apparatus may include a power source and a power-transferring coil coupled to the power source and positioned below the interface surface. A thermal mass may be positioned within the housing and spaced apart from the interface surface. The housing may include a thermal path that is configured to conduct heat from the interface surface to the thermal mass.


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