The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jun. 21, 2017
Applicant:

Inpaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Po-Kai Hsu, New Taipei, TW;

Chih-Ming Su, Taipei, TW;

Assignee:

INPAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H04B 5/00 (2006.01); H01Q 1/22 (2006.01); A45C 11/00 (2006.01); H04B 1/3888 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H04B 5/00 (2013.01); H04B 5/0031 (2013.01); H04B 5/0081 (2013.01); A45C 2011/002 (2013.01); H01Q 1/2208 (2013.01); H04B 1/3888 (2013.01);
Abstract

The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.


Find Patent Forward Citations

Loading…