The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Apr. 18, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hwiyeol Park, Ansan-si, KR;

Hojung Yang, Suwon-si, KR;

Huisu Jeong, Suwon-si, KR;

Kyounghwan Kim, Seoul, KR;

Junhyeong Lee, Seoul, KR;

Sungjin Lim, Suwon-si, KR;

Jin S. Heo, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/131 (2010.01); H01M 4/04 (2006.01); H01M 4/134 (2010.01); H01M 4/36 (2006.01); H01M 4/38 (2006.01); H01M 4/505 (2010.01); H01M 4/525 (2010.01); H01M 10/0525 (2010.01); H01M 4/13 (2010.01); H01M 4/62 (2006.01); H01M 10/04 (2006.01); H01M 4/02 (2006.01); H01M 10/052 (2010.01); H01M 10/0585 (2010.01);
U.S. Cl.
CPC ...
H01M 4/131 (2013.01); H01M 4/0471 (2013.01); H01M 4/13 (2013.01); H01M 4/134 (2013.01); H01M 4/364 (2013.01); H01M 4/38 (2013.01); H01M 4/505 (2013.01); H01M 4/525 (2013.01); H01M 4/626 (2013.01); H01M 10/04 (2013.01); H01M 10/0525 (2013.01); H01M 10/0436 (2013.01); H01M 10/052 (2013.01); H01M 10/0585 (2013.01); H01M 2004/027 (2013.01); H01M 2004/028 (2013.01); H01M 2220/30 (2013.01);
Abstract

A three-dimensional ('3D') electrode structure includes a current collecting layer, a plurality of plates protruding from the current collecting layer and including an active material, and a base layer provided between the current collecting layer and the plurality of plates. The base layer includes an active material-metal sintered composite. The plurality of plates includes an active material-metal sintered composite. A metal content of the active material-metal sintered composite of the plurality of plates is less than a metal content of the active material-metal sintered composite of the base layer. At least one partition wall supporting the plurality of plates is further provided on the base layer.


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