The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jan. 26, 2016
Applicants:
Michael A. Tischler, Vancouver, CA;
Alborz Amini, Vancouver, CA;
Inventors:
Michael A. Tischler, Vancouver, CA;
Alborz Amini, Vancouver, CA;
Assignee:
COOLEDGE LIGHTING INC., Richmond, British Columbia, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/75 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/07812 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0066 (2013.01);
Abstract
In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.