The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Dec. 09, 2015
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Shinya Shoji, Akita, JP;

Makoto Ishii, Akita, JP;

Kazuyuki Umetsu, Akita, JP;

Junji Sugiura, Akita, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 29/06 (2006.01); B28D 5/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); B28D 5/00 (2013.01); B28D 5/0011 (2013.01); B28D 5/0023 (2013.01); H01L 21/02005 (2013.01); H01L 21/02013 (2013.01); H01L 21/02021 (2013.01); H01L 21/02035 (2013.01); H01L 21/304 (2013.01); H01L 22/12 (2013.01);
Abstract

A wafer group facilitates securing uniformity of products manufactured from the wafer group whose composition varies among wafers. A technique excludes uncertain factors in forming OF, forming OF with extremely high probability and extremely high accuracy, the wafer group being constituted by a plurality of wafers obtained from the same ingot, with all wafers having an orientation flat (OF), wherein the wafer group is constituted by 70 or more wafers, and in the OF orientation accuracy of the wafer group represented by an angle, the OF orientation accuracy in each wafer is within ±0.010°.


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