The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jun. 24, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Takuji Okamura, Kyoto, JP;

Akihiko Funahashi, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H04N 5/2253 (2013.01); H05K 1/184 (2013.01); H05K 3/4697 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/16195 (2013.01); H05K 1/183 (2013.01); H05K 3/005 (2013.01); H05K 3/4629 (2013.01); H05K 2203/063 (2013.01);
Abstract

An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.


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