The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jan. 03, 2018
Applicants:
Chul Park, Seoul, KR;
Seonggwan Lee, Daegu, KR;
Minkyeong Park, Pyeongtaek-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/04 (2014.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/075 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/043 (2013.01); H01L 25/074 (2013.01); H01L 25/0756 (2013.01); H01L 25/117 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01);
Abstract
A semiconductor package includes a substrate including a signal pattern on an upper surface thereof, a chip stack on the substrate, and a first semiconductor chip and one or more spacers between the substrate and the chip stack. The chip stack includes one or more second semiconductor chips stacked on the substrate. The one or more spacers and the first semiconductor chip are adjacent to respective corners of a lowermost second semiconductor chip, in plan view. The one or more spacers have the same planar shape as the first semiconductor chip.