The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

May. 21, 2015
Applicant:

Goertek, Inc., Shandong, CN;

Inventors:

Quanbo Zou, Shandong, CN;

Zhe Wang, Shandong, CN;

Assignee:

Goertek, Inc., Shangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 24/00 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 33/62 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95144 (2013.01); H01L 2224/95145 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED, comprises: forming micro-LEDs () on a laser-transparent original substrate (), providing an anisotropic conductive layer () on a receiving substrate (), bringing the micro-LEDs () into contact with the anisotropic conductive layer () on the receiving substrate (), irradiating the original substrate () with laser from the original substrate side to lift-off the micro-LEDs () from the original substrate (), and processing the anisotropic conductive layer (), to electrically connect the micro-LEDs () with the pads (') on the receiving substrate ().


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