The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jun. 16, 2015
Applicant:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Inventor:
Damien Lambert, Los Altos, CA (US);
Assignee:
Skorpios Technologies, Inc., Albuquerque, NM (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G02B 6/42 (2006.01); G02B 6/36 (2006.01); H01L 21/20 (2006.01); H01L 23/31 (2006.01); H01L 21/18 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); G02B 6/3636 (2013.01); G02B 6/423 (2013.01); G02B 6/4232 (2013.01); G02B 6/4245 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 23/3178 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/1161 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13138 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/3012 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8301 (2013.01); H01L 2224/83012 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83139 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83902 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06555 (2013.01);
Abstract
Micro pillars are formed in silicon. The micro pillars are used in boding the silicon to hetero-material such as III-V material, ceramics, or metals. In bonding the silicon to the hetero-material, indium is used as a bonding material and attached to the hetero-material. The bonding material is heated and the silicon and the hetero-material are pressed together. As the silicon and the hetero-material are pressed together, the micro pillars puncture the bonding material. In some embodiments, pedestals are used in the silicon as hard stops to align the hetero-material with the silicon.