The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Feb. 15, 2017
Transsip, Inc., Irvine, CA (US);
Lexiwave Technology (Hong Kong) Limited, Hong Kong, CN;
Chih Wei Wong, Irvine, CA (US);
Henry Lau, Lexington, MA (US);
TRANSSIP, INC., Irvine, CA (US);
Abstract
An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.