The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jun. 05, 2017
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Kazushi Watanabe, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/525 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 7/10 (2006.01); H05K 1/14 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/525 (2013.01); H05K 1/184 (2013.01); H05K 3/301 (2013.01); H05K 3/3405 (2013.01); H05K 3/3436 (2013.01); H05K 3/3447 (2013.01); H05K 7/1053 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H03H 9/059 (2013.01); H03H 9/1085 (2013.01); H05K 1/141 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/613 (2015.11);
Abstract
An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination.