The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Apr. 23, 2015
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventor:
Ryo Maruyama, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/4882 (2013.01); H01L 23/473 (2013.01); H01L 24/32 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/15787 (2013.01);
Abstract
A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.