The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Mar. 02, 2018
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventor:
Kenichi Sawanaka, Yokohama Kanagawa, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15321 (2013.01);
Abstract
A semiconductor memory device includes a housing having a wall, a circuit board located in the housing and spaced from the wall and extending along the surface of the wall, a memory located on the circuit board, a heat conduction member interposed, and compressed, between the wall and the memory. The wall includes an uneven region comprising contact portions contacting the heat conduction member and recess portions located between the contact portions. The recess portions are recessed inwardly of the wall from the ends of the contact portions in a direction away from the location of the memory.