The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Dec. 01, 2017
Applicant:

Nuvotronics, Inc., Radford, VA (US);

Inventor:

J. Robert Reid, Billerica, MA (US);

Assignee:

CUBIC CORPORATION, San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/055 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01P 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/52 (2013.01); H01L 23/055 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/66 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01P 3/06 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48097 (2013.01); H01L 2224/48229 (2013.01); H01L 2924/19033 (2013.01);
Abstract

Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.


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