The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Apr. 11, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tae Seung Cho, San Jose, CA (US);

Soonam Park, Sunnyvale, CA (US);

Junghoon Kim, Santa Clara, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Shankar Venkataraman, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/26 (2006.01); H01L 21/66 (2006.01); G01N 21/73 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); G01N 21/73 (2013.01); H01J 37/32568 (2013.01); H01J 37/32743 (2013.01); H01L 21/31116 (2013.01); H01L 21/67253 (2013.01); G01N 2201/08 (2013.01); G01N 2201/0833 (2013.01); H01J 37/32082 (2013.01); H01J 2237/3341 (2013.01);
Abstract

Methods and systems for etching substrates using a remote plasma are described. Remotely excited etchants are formed in a remote plasma and flowed through a showerhead into a substrate processing region to etch the substrate. Optical emission spectra are acquired from the substrate processing region just above the substrate. The optical emission spectra may be used to determine an endpoint of the etch, determine the etch rate or otherwise characterize the etch process. A weak plasma may be present in the substrate processing region. The weak plasma may have much lower intensity than the remote plasma. In cases where no bias plasma is used above the substrate in an etch process, a weak plasma may be ignited near a viewport disposed near the side of the substrate processing region to characterize the etchants.


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