The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Sep. 26, 2016
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventors:
Chun-Lung Tseng, Hsinchu, TW;
Hung-Yao Lin, Hsinchu, TW;
Hsin-Yi Wang, Hsinchu, TW;
Chin-Kang Hu, Hsinchu, TW;
Sheng-Hsiung Chuang, Hsinchu, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/14 (2006.01); H05K 3/02 (2006.01); H05K 3/04 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B32B 37/025 (2013.01); B32B 38/10 (2013.01); H01L 21/67092 (2013.01); H05K 3/025 (2013.01); H05K 3/046 (2013.01); B32B 2309/12 (2013.01); B32B 2311/00 (2013.01); B32B 2311/02 (2013.01); B32B 2311/12 (2013.01); B32B 2311/24 (2013.01); B32B 2457/14 (2013.01); B44C 1/14 (2013.01);
Abstract
A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.