The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Apr. 02, 2014
Applicant:
Hanwha Techwin Co., Ltd., Changwon-si, KR;
Inventor:
Sung Wook Kim, Changwon-si, KR;
Assignee:
HANWHA PRECISION MACHINERY CO., LTD., Changwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B23K 26/00 (2014.01); B23K 26/402 (2014.01); B28D 5/00 (2006.01); B23K 26/53 (2014.01); H01L 21/78 (2006.01); B23K 26/40 (2014.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); B23K 26/70 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B23K 26/0738 (2013.01); B23K 26/0853 (2013.01); B23K 26/0876 (2013.01); B23K 26/40 (2013.01); B23K 26/402 (2013.01); B23K 26/53 (2015.10); B23K 26/702 (2015.10); B28D 5/0011 (2013.01); H01L 21/78 (2013.01); B23K 2101/40 (2018.08); B23K 2103/172 (2018.08); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08);
Abstract
A method and an apparatus for thinning a wafer are provided. The method for thinning a wafer, according to one embodiment of the present invention, comprises the steps of: irradiating a line beam focused at a specific depth of the wafer; scanning the wafer by using the line beam so as to form an interface at the specific depth of the wafer; and cleaving the wafer on which the interface is formed into a pattern wafer and a dummy wafer.