The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Apr. 25, 2018
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Dekui Qi, Shanghai, CN;

Haifang Zhang, Shanghai, CN;

Xuanjie Liu, Shanghai, CN;

Zheng Chen, Shanghai, CN;

Xin Li, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/041 (2013.01); H01F 5/00 (2013.01); H01F 17/0013 (2013.01); H01F 2017/002 (2013.01);
Abstract

A method of fabricating a spiral inductor includes providing a substrate having a top surface and a bottom surface, forming a plurality of through holes aligned in a vertical plane and spaced apart from each other, forming a metal interconnect structure having at least one top metal layer on the top surface of the substrate, the metal interconnect structure configured to connect to a top portion of the through holes, and forming a redistribution layer having at least a bottom layer on the bottom surface of the substrate. The redistribution layer is configured to connect to a bottom portion of the through holes to form a spiral structure.


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