The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Feb. 18, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jung hyuk Jung, Suwon-si, KR;
Woon Chul Choi, Suwon-si, KR;
Jun Ah, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
Hye Min Bang, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Abstract
A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.