The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Mar. 04, 2016
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Inventors:

Hideo Fukuda, Tokyo, JP;

Dai Fujiwara, Tokyo, JP;

Tsuneo Aoi, Tokyo, JP;

Hiroshi Kaneiwa, Aichi, JP;

Yuki Amano, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/30 (2006.01); H01F 5/06 (2006.01); H02K 3/30 (2006.01); H02K 15/04 (2006.01); H01B 13/06 (2006.01); H01B 7/00 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01B 3/308 (2013.01); H01B 3/302 (2013.01); H01B 3/303 (2013.01); H01B 3/307 (2013.01); H01B 7/0009 (2013.01); H01B 13/06 (2013.01); H01B 13/065 (2013.01); H01F 5/06 (2013.01); H01F 27/2823 (2013.01); H02K 3/30 (2013.01); H02K 15/04 (2013.01);
Abstract

A rectangular wire having: a multilayer conductor member constructed by stacking, in a thickness direction, a rectangular metallic conductor that has a layer of a thermosetting resin formed on the outer periphery thereof, the thermosetting resin having a glass transition temperature of 100° C. or more and 200° C. or less and having a urethane bond; and a layer of a thermoplastic resin having a melting point of 300° C. or more on the outer periphery of the multilayer conductor member.


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