The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Nov. 23, 2016
Applicant:

Johnson Controls Technology Company, Plymouth, MI (US);

Inventors:

Joseph R. Ribbich, Waukesha, WI (US);

Jacob P. Hicks, Milwaukee, WI (US);

Zachary N. Posten, Oshkosh, WI (US);

Daniel R. Gottschalk, Racine, WI (US);

Michael L. Ribbich, Oconomowoc, WI (US);

Charles J. Gaidish, South Milwaukee, WI (US);

Assignee:

Johnson Controls Technology Company, Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 8/61 (2018.01); G05B 19/048 (2006.01); G06F 8/65 (2018.01); G05B 19/042 (2006.01); F24F 11/30 (2018.01); F24F 11/62 (2018.01); G05B 15/02 (2006.01); F24F 110/10 (2018.01); F24F 11/63 (2018.01); F24F 11/56 (2018.01); F24F 11/59 (2018.01); F24F 11/52 (2018.01);
U.S. Cl.
CPC ...
G06F 8/61 (2013.01); F24F 11/30 (2018.01); F24F 11/62 (2018.01); G05B 15/02 (2013.01); G05B 19/048 (2013.01); G05B 19/0426 (2013.01); G06F 8/65 (2013.01); F24F 11/52 (2018.01); F24F 11/56 (2018.01); F24F 11/59 (2018.01); F24F 11/63 (2018.01); F24F 2110/10 (2018.01); G05B 2219/2614 (2013.01); G05B 2219/2642 (2013.01);
Abstract

A thermostat includes a motherboard, a first modular board, and a display. The motherboard is configured to perform a thermostat function and generate a user interface a user interface including information relating to the thermostat function. The first modular board is configured to be added to the thermostat by coupling the first modular board to the motherboard and to be removed from the thermostat by decoupling the first modular board from the motherboard. The first modular board is configured to supplement the thermostat function performed by the motherboard when the first modular board is coupled to the motherboard. The display is communicably coupled to the motherboard. The display is configured to display the user interface. The motherboard is configured to adaptively reconfigure the user interface to include supplemental information provided by the first modular board in response to coupling of the first modular board to the motherboard.


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