The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Oct. 18, 2018
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Alejandro Manuel de Pena, Sant Cugat del Valles, ES;
Sebastia Cortes Herms, Barcelona, ES;
Josep Giralt Adroher, Sant Cugat del Valles, ES;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); B29C 64/40 (2017.01); B29C 64/386 (2017.01); B29C 64/00 (2017.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B29C 64/00 (2017.08); B29C 64/386 (2017.08); B29C 64/40 (2017.08); B33Y 50/02 (2014.12); G05B 2219/35134 (2013.01); G05B 2219/49007 (2013.01);
Abstract
In one example, an additive manufacturing system includes a processing system to obtain characteristic data including conditions under which a heat reservoir may be added close to a portion of the object, based on the characteristic data, add sacrificial structure data to the three-dimensional object data for a sacrificial heat reservoir structure close to a portion of the object and not connected to the object, and generate multiple slice images from the three-dimensional object data including the sacrificial structure data.