The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Dec. 30, 2014
Applicants:

Robert Bosch Gmbh, Stuttgart, DE;

Bongsang Kim, Mountain View, CA (US);

Ando Feyh, Reutlingen, DE;

Andrew Graham, Redwood City, CA (US);

Gary O'brien, Palo Alto, PA (US);

Michael Baus, Bietigheim-Bissingen, DE;

Ralf Maier, Gerlingen, DE;

Mariusz Koc, Stuttgart, DE;

Inventors:

Bongsang Kim, Mountain View, CA (US);

Ando Feyh, Reutlingen, DE;

Andrew Graham, Redwood City, CA (US);

Gary O'Brien, Palo Alto, PA (US);

Michael Baus, Bietigheim-Bissingen, DE;

Ralf Maier, Gerlingen, DE;

Mariusz Koc, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G01C 19/5769 (2012.01); G01P 15/08 (2006.01); G01D 5/241 (2006.01); G01P 1/00 (2006.01); G01P 15/18 (2013.01);
U.S. Cl.
CPC ...
G01C 19/5769 (2013.01); G01D 5/241 (2013.01); G01P 1/003 (2013.01); G01P 1/023 (2013.01); G01P 15/0802 (2013.01); B81B 2201/0235 (2013.01); G01P 15/18 (2013.01); G01P 2015/084 (2013.01); G01P 2015/0882 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/16152 (2013.01);
Abstract

In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.


Find Patent Forward Citations

Loading…