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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10317004 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Oct. 04, 2016

Porous plate-shaped filler, heat insulation film, and method for producing porous plate-shaped filler

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Hiroharu Kobayashi, Nagoya, JP;

Takahiro Tomita, Nagoya, JP;

Akinobu Oribe, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Frank J Vineis

Assistant Examiner:

Lawrence D Ferguson

Int. Cl.
CPC ...
C09D 7/40 (2018.01); F16L 59/02 (2006.01); C09D 7/62 (2018.01); C04B 38/00 (2006.01); C04B 38/06 (2006.01); C09D 201/00 (2006.01); C09C 1/00 (2006.01); C09C 1/30 (2006.01); C09C 1/36 (2006.01); C09C 1/40 (2006.01); C09C 3/00 (2006.01); C09C 3/04 (2006.01); C09C 3/06 (2006.01); C09C 3/10 (2006.01); C09D 183/04 (2006.01); C04B 35/48 (2006.01);
U.S. Cl.
CPC ...
F16L 59/028 (2013.01); C04B 38/00 (2013.01); C04B 38/06 (2013.01); C09C 1/00 (2013.01); C09C 1/309 (2013.01); C09C 1/3607 (2013.01); C09C 1/407 (2013.01); C09C 3/00 (2013.01); C09C 3/043 (2013.01); C09C 3/06 (2013.01); C09C 3/10 (2013.01); C09D 7/40 (2018.01); C09D 7/62 (2018.01); C09D 183/04 (2013.01); C09D 201/00 (2013.01); C01P 2004/24 (2013.01); C01P 2006/32 (2013.01); C04B 35/48 (2013.01);
Abstract

A porous plate-shaped filler is a plate shape having an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. Furthermore, the porous plate-shaped fillerincludes plate-shaped poreshaving an aspect ratio of 1.5 or more. Consequently, in the porous plate-shaped filler, a thermal conductivity is low. The heat insulation film includes the porous plate-shaped filler, whereby a heat insulation effect of the heat insulation film can improve.

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