The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Feb. 22, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Kenji Takai, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 15/00 (2006.01); C25D 1/00 (2006.01); C25D 3/46 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C25D 15/00 (2013.01); C25D 1/00 (2013.01); C25D 3/46 (2013.01); C25D 5/022 (2013.01); C25D 5/48 (2013.01); H05K 1/028 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01);
Abstract
A flexible electrically conductive structure includes: a first polymer layer; and an electrically conductive layer disposed on a surface of the first polymer layer, wherein the electrically conductive layer includes an electrically conductive metal and a nanocarbon material, and wherein the flexible wiring board is to be used with a bending portion provided at least one position of the electrically conductive layer.