The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Mar. 31, 2015
Applicant:

Jfe Steel Corporation, Tokyo, JP;

Inventors:

Katsuyuki Ichimiya, Tokyo, JP;

Masao Yuga, Tokyo, JP;

Kazukuni Hase, Tokyo, JP;

Shigeru Endo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/46 (2006.01); C21D 8/02 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/08 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/42 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/54 (2006.01); C22C 38/58 (2006.01); C22C 38/00 (2006.01); C21D 1/18 (2006.01); C21D 1/25 (2006.01); C22C 38/18 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); C21D 1/18 (2013.01); C21D 1/25 (2013.01); C21D 8/0226 (2013.01); C21D 8/0247 (2013.01); C21D 8/0263 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C22C 38/58 (2013.01);
Abstract

A high-tensile-strength steel plate is provided with a new chemical composition design that guarantees the same properties as a 50 mm thick steel plate even in a steel plate with a thickness of 100 mm or greater, without the yield stress being affected by the plate thickness. By mass %, the chemical composition includes C: 0.02% to 0.08%, Si: 0.01% to 0.35%, Mn: 1.4% to 2.0%, P: 0.007% or less, S: 0.0035% or less, Al: 0.010% to 0.060%, Ni: 0.5% to 2.0%, Mo: 0.10% to 0.50%, Nb: 0.005% to 0.040%, Ti: 0.005% to 0.025%, B: less than 0.0003%, N: 0.002% to 0.005%, Ca: 0.0005% to 0.0050%, and O: 0.003% or less, with the components additionally satisfying a predetermined relationship.


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