The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jun. 02, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Michael Benton Free, St. Paul, MN (US);

Audrey A. Sherman, Woodbury, MN (US);

Daniel W. Hennen, Cottage Grove, MN (US);

Brent R. Hansen, New Richmond, WI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); B32B 27/28 (2006.01); B32B 37/26 (2006.01); B32B 38/06 (2006.01); C09J 175/02 (2006.01); C09J 183/04 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01);
U.S. Cl.
CPC ...
C09J 175/02 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 37/26 (2013.01); B32B 38/06 (2013.01); C09J 7/38 (2018.01); C09J 7/403 (2018.01); C09J 183/04 (2013.01); B32B 2037/268 (2013.01); B32B 2375/00 (2013.01); B32B 2405/00 (2013.01); C09J 2201/606 (2013.01);
Abstract

Methods of forming laminating adhesive articles include providing a multi-layer article, and a tool with a structured surface. The multi-layer articles include a substrate, an adhesive layer, and a liner or may just include an adhesive layer and a liner. The multi-layer article is placed between the structured surface of the tool and a support surface and the tool is embossed against the liner by applying pressure or a combination of pressure and heat. The embossing causes the structures on the surface of the tool to distort the liner and the adhesive layer but does not distort the substrate. The distortion in the liner is retained upon release of the applied pressure. Upon removal of the liner from the adhesive layer, the structures on the adhesive layer are unstable, but do not immediately collapse.


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