The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Nov. 05, 2013
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventor:
Kengo Imamura, Ebina, JP;
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B32B 37/06 (2006.01); C09J 5/06 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 37/12 (2006.01); C08K 7/22 (2006.01); C08L 21/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); C08K 7/22 (2013.01); C08L 21/00 (2013.01); C09J 5/06 (2013.01); B32B 2037/1253 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2605/08 (2013.01); C09J 2205/11 (2013.01); C09J 2400/163 (2013.01); C09J 2421/00 (2013.01); C09J 2463/00 (2013.01); Y10T 428/24942 (2015.01);
Abstract
A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.