logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10316159 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Jul. 20, 2016

Epoxy resin composition, prepreg, and fiber reinforced material

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Reo Takaiwa, Ehime, JP;

Junko Kawasaki, Ehime, JP;

Kentaro Sano, Ehime, JP;

Noriyuki Hirano, Ehime, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/04 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08L 63/06 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/60 (2006.01); B32B 5/24 (2006.01); C08K 5/21 (2006.01); C08K 5/31 (2006.01); C08K 5/41 (2006.01); C08L 81/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 5/24 (2013.01); B32B 27/38 (2013.01); C08G 59/3227 (2013.01); C08G 59/3245 (2013.01); C08G 59/4021 (2013.01); C08G 59/50 (2013.01); C08G 59/5033 (2013.01); C08G 59/60 (2013.01); C08K 5/21 (2013.01); C08K 5/31 (2013.01); C08K 5/41 (2013.01); C08L 63/00 (2013.01); C08L 63/06 (2013.01); C08L 81/06 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); C08J 2363/00 (2013.01); C08L 2205/02 (2013.01);
Abstract

An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

Find Patent Forward Citations

Takaiwa, Reo. (2019). Epoxy resin composition, prepreg, and fiber reinforced material (U.S. Patent No. 10316159). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10316159

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…