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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10315917 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Jan. 08, 2018

Method for manufacturing a micromechanical sensor device and corresponding micromechanical sensor device

Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Andreas Krauss, Tuebingen, DE;

Elisabeth Preiss, Rapperswil, CH;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:

Norton Rose Fulbright US LLP

Gerard Messina

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Valerie N Newton

Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 3/00 (2006.01); G01N 33/00 (2006.01); G01N 27/14 (2006.01); G01N 27/12 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0081 (2013.01); G01N 33/0009 (2013.01); G01N 33/0013 (2013.01); B81B 2201/0214 (2013.01); G01N 27/128 (2013.01); G01N 27/14 (2013.01);
Abstract

A micromechanical sensor device and a corresponding manufacturing method. The micromechanical sensor device is equipped with a substrate which includes a diaphragm area, multiple sensor layer areas being formed on the diaphragm area, which have a particular structured sensor layer; and a particular electrode device, via which the sensor layer areas are electrically connectable outside of the diaphragm area, the sensor layer areas being structured in such a way that they have length and width dimensions of a magnitude between 1 and 10 micrometers.

Find Patent Forward Citations

Krauss, Andreas. (2019). Method for manufacturing a micromechanical sensor device and corresponding micromechanical sensor device (U.S. Patent No. 10315917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10315917

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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