The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Sep. 09, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/00 (2006.01); B01L 3/02 (2006.01); B01L 3/00 (2006.01); G01N 15/14 (2006.01); G01N 21/01 (2006.01);
U.S. Cl.
CPC ...
B01L 3/0268 (2013.01); B01L 3/502707 (2013.01); B01L 3/502761 (2013.01); B01L 3/502776 (2013.01); G01N 1/00 (2013.01); G01N 15/1484 (2013.01); G01N 21/01 (2013.01); B01L 2200/0652 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2400/0433 (2013.01); B01L 2400/0487 (2013.01); G01N 2015/149 (2013.01);
Abstract
A chip device is provided. The chip device includes a flow channel configured to pass a fluid therein; an ejection portion including an opening toward an end face of a substrate layer including at least one layer, the ejection portion is configured to provide the fluid from the flow channel, and a cavity provided between the opening of the ejection portion and the end face of the substrate layer, wherein at least a portion of the cavity is provided at the end face of the substrate layer.