The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jun. 05, 2017
Applicant:
Japan Aviation Electronics Industry, Limited, Tokyo, JP;
Inventors:
Junya Sato, Tokyo, JP;
Ryosuke Mitsui, Tokyo, JP;
Assignee:
JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); H01R 4/02 (2006.01); H01R 4/04 (2006.01); H01R 4/70 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01); C09D 11/037 (2014.01); C09D 11/14 (2006.01); C09D 11/322 (2014.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H01R 12/52 (2011.01);
U.S. Cl.
CPC ...
H05K 3/1291 (2013.01); C09D 11/037 (2013.01); C09D 11/14 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); C09D 11/52 (2013.01); H01R 4/026 (2013.01); H01R 4/04 (2013.01); H01R 4/70 (2013.01); H05K 1/111 (2013.01); H05K 3/0011 (2013.01); H05K 3/321 (2013.01); H05K 3/381 (2013.01); H05K 3/382 (2013.01); H05K 3/403 (2013.01); H05K 3/4076 (2013.01); H01R 12/52 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/10659 (2013.01); Y02P 70/611 (2015.11);
Abstract
There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.