The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

May. 18, 2015
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Elias Russegger, Golling, AT;

Gerhard Schefbanker, Scheffau am Tennengebirge, AT;

Martin Wallinger, Abtenau, AT;

Kevin Ptasienski, Fenton, MO (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/26 (2006.01); H01C 17/242 (2006.01); H01C 17/10 (2006.01);
U.S. Cl.
CPC ...
H05B 3/26 (2013.01); H01C 17/10 (2013.01); H01C 17/242 (2013.01); H05B 2203/002 (2013.01); H05B 2203/003 (2013.01); H05B 2203/01 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); Y10T 29/49083 (2015.01);
Abstract

A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.


Find Patent Forward Citations

Loading…