The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

May. 26, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Kevin Juho Venalainen, Seattle, WA (US);

Brian W. Aznoe, Sherwood, OR (US);

Dana William Bourke, Redmond, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 1/04 (2006.01); H04R 19/00 (2006.01); H04R 1/38 (2006.01); H04R 1/32 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0061 (2013.01); B81C 1/00309 (2013.01); H04R 1/04 (2013.01); H04R 1/38 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0315 (2013.01); H04R 1/02 (2013.01); H04R 1/326 (2013.01); H04R 2201/003 (2013.01); H04R 2499/15 (2013.01);
Abstract

An electronic device with directional MEMS microphone assembly is provided, including a MEMS microphone capsule with a PCB affixed thereto, and a housing affixed to the PCB. The microphone assembly includes a first internal port and a second internal port through the PCB, wherein the first and second internal ports fluidically communicate with the MEMS microphone capsule. The microphone assembly further includes first and second external ports through the housing, wherein the first external port is offset from the first internal port in an offset direction perpendicular to a thickness direction of the microphone assembly. The microphone assembly further includes first and second cavities located between the PCB and the housing, wherein the first cavity fluidically communicates with the first internal port and the first external port, and the second cavity fluidically communicates with the second internal port and the second external port.


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