The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jun. 08, 2018
Applicant:

Oclaro Japan, Inc., Kanagawa, JP;

Inventors:

Takuya Sato, Kanagawa, JP;

Keiichi Murakami, Kanagawa, JP;

Koki Sato, Kanagawa, JP;

Assignee:

Oclaro Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/00 (2006.01); H01S 5/024 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02476 (2013.01); H01S 5/024 (2013.01); H01S 5/02236 (2013.01); H01S 5/02446 (2013.01); H01S 5/02453 (2013.01); H01S 5/02469 (2013.01); H01S 5/0222 (2013.01); H01S 5/02212 (2013.01); H01S 5/02407 (2013.01); H01S 5/02415 (2013.01);
Abstract

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.


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